SoM Overview

SoM Overview section enumerates the SoM processing, peripherals and packaging specifications.

Processing Specifications

Feature Description
GPU 8 NVIDIA Carmel ARMv8.2 (64bit) CPU @ 2.26GHz / 8MB L2 + 4MB L3
CPU 699 pin board to board connector
Memory 16 GB, 256-bit LPDDR4x @ 2133MHz (137GB/s)
Storage 32GB eMMC 5.1 Flash Storage @ 200MHz
DLA 2 NVDLA engines Deep Learning Accelerator
VA (2x) 7-way VLIW Vision Accelerator
Encoder
  • H.265(HEVC) up to 2x 4Kp60
  • H.264 up to 4x 4Kp60
  • VP9 up to 2x 4Kp60
  • JPEG up to 16Kx16K
Decoder
  • H.265(HEVC) up to 2x 8Kp30
  • H.264 up to 4x 4Kp60
  • VP9 up to 4x 4Kp60
  • JPEG up to 16Kx16K
  • MPEG-4
  • MPEG-2
  • VC-1

Peripherals

  • xHCI host controller with integrated PHY
  • 3 x USB 3.1 (10GT/s)
  • 4 x USB 2.0
  • SD/MMC Controller
  • Display
    • 3x eDP/DP/HDMI at 4Kp60 | HDMI 2.0, DP HBR3
  • Camera
    • 16x CSI-2 Lanes (40 Gbps in D-PHY V1.2 or 109 GBps in CPHY v1.1)
    • 8x SLVS-EC lanes (up to 18.4 Gbps)
    • Up to 16 simultaneous cameras
  • PCie
    • 5x 16GT/s gen4 controllers | 1x8, 1x4, 1x2, 2x1
    • (3x) Root Port + Endpoint
    • (2x) Root Port
  • Ethernet — Gigabit Ethernet-AVB over RGMII
  • 5 x UART
  • 3 x SPI
  • 5 x I2C
  • 2 x CAN
  • 4 x I2S

Package

Feature Description
Module Size 100 mm x 87 mm
Connector 699 pin board to board connector
Operating Temperature Range from -25C to 80C
Power Input 9V - 20V
TPP Integrated Thermal Transfer Plate with Heatpipe